Device Programming & Surface Mount Axial and Radial Component Processing

Surface Mount Taping: Conform to EIA Standards or costomer specific requirements All Activities take place in an ESD/Humidity controlled environment Most standard carrier tapes in stock Bake and Dry pack capabilities available SOIC, SOJ, TSOP, PLCC, BGA, QFP and more! Fully automated tube to tape, tray to tape Vision inspection for lead, mark and orientation Bare Die and Chip Scale Packages Axial & Radial Taping: Conform to EIA 296 and EIA 486 taping speicifications Electrolytic capacitors, TO92s, LEDs Resistors, capacitors, diodes